Jan 03, 2020
The communication world has evolved for an era in almost 10 years. The 2G era began in the 1990s. 4G networks rose around 2010. 5G networks will be officially commercialized in 2020. I have to say that 5G networks are really coming ...
In some cities, the three major operators have started to deploy 5G on a large scale. Pilot cities such as Beijing and Wuhan have achieved full coverage of 5G urban areas in 2019. To achieve 5G technology, the use of circuit boards is indispensable. In the electronics industry, flexible circuit boards can be said to be blood vessels for electronic products. Especially under the trend of thinning, miniaturization, wearable, and foldable electronic equipment, flexible circuit boards have the advantages of high wiring density, light and thin, flexible, and three-dimensional assembly, and the market development trend is moderately high, demand , Increasingly strong.
The advent of the 5G era has also placed higher requirements on the R & D, production, and management capabilities of the broad circuit board industry. Enterprises must provide more cost-effective products to the market at a faster rate. Improving product management traceability has also become a crucial part.
For processing, common traditional processing methods include die, milling cutter, stamping and so on. However, this kind of mechanical contact type board separation process has stress, is easy to produce burrs, dust, and is not high enough in accuracy, so it is gradually replaced by the laser cutting process. Laser is used as a non-contact machining tool. Can apply high intensity light energy (650mW / mm2) to a small focus (100-500UM). Such high energy can be used for laser cutting, drilling, marking, welding, scribing and other Kind of processing.
Laser cutting PCB / FPC eliminates the need for several molds like traditional stamping, saving time and costs; and laser cutting is non-contact processing, which eliminates the damage to components during contact processing such as mechanical stamping and greatly improves the yield. Laser cutting PCB / FPC is an inevitable trend of development.
Advantages of laser cutting flexible circuit boards
1. As the circuit density and pitch of FPC products continue to increase, and the FPC graphic contours are becoming more and more complicated, this makes it more and more difficult to make FPC molds. The laser cutting of flexible circuit boards uses NC processing, and no mold processing is required. , Save the cost of mold opening;
2. Due to the shortcomings of mechanical processing and restricting the processing accuracy, the laser cutting flexible circuit board uses high-performance ultraviolet laser light source with good beam quality. Better cutting effect
3. Because the traditional processing technology is a contact machining method. Processing stress will inevitably be caused to FPC, which may cause physical damage. Laser cutting of flexible circuit boards is non-contact processing, which effectively avoids damage and deformation of processing materials.
With the development of flexible electronic technology, various electronic products have been born. The application of flexible electronics will drive a trillion-dollar market, assist traditional industries to increase industrial added value, and bring revolutionary changes to industrial structure and human life.