威廉希尔官方下载

Picosecond Laser Is the Future for 3C Processing

威廉希尔官方下载Mar 31, 2020

Laser processing helps to manufacture in China.

Because of its excellent physical properties, the laser can be used to process a variety of metals and nonmetals, especially for materials with high hardness, high brittleness, and high melting point. It is suitable for fine processing of high-end materials. Laser machining has the characteristics of good cutting quality, high cutting efficiency, and fast cutting speed, which has outstanding advantages compared with traditional contact machining. At the same time, the combination of the laser processing system and computer numerical control technology can form automatic intelligent processing equipment, which has become the key technology for industrial enterprises to implement metal sheet metal processing; and the new laser technologies such as picosecond, femtosecond and ultraviolet laser show strong demand in the field of non-metallic material processing in the consumer electronics industry. Under the background of the "made in China 2025" strategy, the traditional industrial manufacturing industry is facing a deep transformation. One of the directions is to improve efficiency and turn to high-end precision processing with higher added value and higher technical barriers. Laser processing is fully in line with this theme. Laser and laser processing equipment have emerged in the high-end 3C manufacturing fields, such as the production of consumer electronic touch screen modules, semiconductor wafer chips, etc., and show a new application prospect in the fields of sapphire processing, curved glass, and ceramic production.

Picosecond laser processing leads to the new direction of 3C industry processing.

Picosecond laser, as a typical representative of ultra short pulse laser, has the characteristics of ultra short pulse width and ultra-high peak power. It has a wide range of processing objects, especially suitable for processing brittle materials and heat-sensitive materials such as sapphire, glass, ceramics, etc., so it is suitable for the application of the micro processing industry in electronic industry. In recent two years, the demand for picosecond processing equipment has increased rapidly, mainly because the application of fingerprint identification module in mobile phones since last year has led the purchase of picosecond laser, a piece of special equipment. Fingerprint module involves laser processing:

① Wafer scribing, ② chip cutting, ③ cover plate cutting, ④ FPC soft board contour cutting and drilling, ⑤ laser marking, etc.

It mainly deals with the processing of Sapphire/glass cover plate and IC chip. Since 2015, iPhone 6 has officially used fingerprint recognition and promoted the popularity of a number of domestic brands. At present, the penetration rate of fingerprint recognition is less than 50%. Therefore, the picosecond machine used to process the fingerprint recognition module still has a large development space. At the same time, the picosecond machine can also be used in PCB drilling, wafer cutting, and so on, and its application field is constantly expanding. Especially with the application of high value-added brittle materials such as sapphire and ceramics in mobile phones in the future, picosecond laser processing equipment will become an important part of 3C automation equipment. We believe that the picosecond laser will play an extensive and profound role in the field of 3C automatic processing equipment in the future.


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