Jan 06, 2020
1. Increase the power of the laser marking machine, which is the most direct adjustment method;
2. Slow down the marking speed of the laser marking machine. Under the same power and the same other parameters, just modify the speed when marking. Of course, the depth of the marking will be deeper;
3. The field lens of the laser marking machine is changed to a small field lens. After the conversion, the depth of marking will be deeper. For example, the current semiconductor laser marking machine can wildly use a field lens of 110 to become With a field lens of 50, its total laser energy and lettering depth will reach about 2 times the previous effect;
4. Changing the imported field lens can also make the marking lettering deeper. For example, semiconductor laser coders use German lenses, and CO2 lenses use American lenses, both of which can rise to a certain depth;
5. If the laser mode of the laser marking machine becomes better, the marking depth will also be improved to a certain extent. For example, if a semiconductor laser marking machine is used, a small hole will be added to increase the cooling accuracy. Biggest, roundest, brightest;
6. Replace the laser with a more successful land-type laser, and directly increase the lettering depth of the laser coder;
7. Replace better laser marking accessories, such as semiconductor machine laser marking machine, using imported Q switch, the marking depth will be better.