威廉希尔官方下载Apr 23, 2020
With the overall transformation and upgrading of the domestic manufacturing industry, in the PCB segmentation market, people also put forward higher requirements for the quality of PCB products. The traditional PCB board dividing equipment is mainly processed by cutting, milling, and gonging. It has more or fewer disadvantages, such as dust, burr, stress, etc. it has a great influence on the PCB board with small or containing components, and it seems to have some difficulties in the new application. The application of laser technology in PCB cutting provides a new solution for PCB cutting.
The advantages of laser cutting PCB are small cutting gap, high precision, small heat affected area, and so on. Compared with traditional PCB cutting technology, laser cutting PCB is completely dust-free, stress-free, burr-free, and the cutting edge is smooth and neat. However, at present, the laser cutting PCB equipment is not fully mature, and there are still obvious shortcomings in laser cutting PCB.
At present, the major disadvantage of laser cutting PCB equipment is that the cutting speed is low, the thicker the cutting material is, the lower the cutting speed is, and the processing speed of different materials also has some differences. Compared with traditional processing methods, it can not meet the needs of large-scale mass production. At the same time, the hardware cost of laser equipment itself is high. A laser cutting PCB equipment is about 2-3 times the price of traditional milling cutter equipment. The higher the power is, the more expensive the price is. If three laser cutting PCB equipment can achieve the speed of a milling cutter cutting PCB equipment, the processing cost and labor cost will increase greatly. In addition, when laser cutting thick materials such as PCB with a thickness of more than 1mm, there will be a carbonization effect on the cross-section, which is also the reason why many PCB manufacturers cannot accept laser cutting PCB.
All in all, the current laser cutting PCB equipment in the market has the disadvantages of high cost and low speed, which leads to the immature market. Only mobile phone PCB, automobile PCB, medical PCB, and other manufacturers with relatively high requirements use it. However, with the continuous progress of laser technology, the improvement of laser power, the improvement of beam quality, and the upgrading of cutting technology, the future equipment stability will be gradually improved, and the equipment cost will be lower and lower. The future application of laser cutting in the PCB market is worth looking forward to. It will be another growth point of the laser industry.